ENCAPSULATED SEMICONDUCTOR DEVICE

摘要

A glass sealed semiconductor diode is disclosed. The diode includes a fusion which comprises a body of semiconductor material having a PN junction therein and metal electrodes affixed to opposed major surfaces of the semiconductor body. The fusion is encircled by an annular-shaped glass member with an inner surface of the annular-shaped glass member fused to an edge surface of the fusion to form a protective layer over the PN junction. An annular metallic member encircles the annular glass member with an inner surface thereof fused to an outer surface of the annular glass member.