| 摘要 |
PURPOSE:To obtain a semiconductor device which increases the die bonding reliability of the chemical compound semiconductor element as well as omits the external diode for protection by inserting the silicon diode element between the chemical compound semiconductor element and the metal frame. CONSTITUTION:Silicon diode chip 20, a silicon diode element, and GaAsLED chip 10 are bonded together in the same forward direction and in series via gold-silicon eutectic alloy 50 to from compound chip 30. This chip 30 is then bonded onto metal frame 40 via alloy 50. |
