发明名称 METHOD AND APPARATUS FOR TAKEUP OF BONDING WIRING FOR SEMICONDUCTOR
摘要 PURPOSE:To enhance operability, and to obtain a small-sized and inexpensive winding apparatus by annealing a drawn bonding wire, cooling it, then taking up the starting end of a winding on a jig, and then winding it in a length set on a takeup reel. CONSTITUTION:An electric furnace B is held therein at a predetermined temperature such as 300-500 deg.C, a wire (a) is passed at a predetermined linear speed through the furnace to be annealed thereby to impart it with wire characteristics necessary for bonding characteristics. The wire (a) passed through the furnace B is guided to a takeup mechanism D through a guide roller 7. The wire (a) moving along a guide roller 7 is cooled in contact with cooling water 6 so that the adhering strength of the surface is reduced. Then, the end of the wire (a) led through a water cooling mechanism C to a takeup jig 9 is guided into a groove 9a in a state that it is anchored by a tape 12 on the outer surface of the inner edge 9b, and the wire (a) is taken up in a predetermined length in the groove 9a upon rotation of a rotary shaft 8.
申请公布号 JPH0212935(A) 申请公布日期 1990.01.17
申请号 JP19880164191 申请日期 1988.06.30
申请人 TANAKA ELECTRON IND CO LTD 发明人 KOIZUMI TAMOTSU;FUKUI YASUO;IMAHAMA YASUSHI
分类号 H01L21/60 主分类号 H01L21/60
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