| 摘要 |
PURPOSE:To avoid occurrence of dispersion of the intensity as well as flaws on the pellet surface when having the wire bonding by fixing first the thin wire onto the surface of the solder layer temporarily and then giving the electric resistance welding after heating the solder layer up to the temperature at which the solder layer fuses. CONSTITUTION:Silver wire 3 is placed on solder electrode 2 formed to semiconductor pellet 1, and two electrodes 4a and 4b are provided on wire 3 with space D between as if they sandwiched both the solder electrode part and the contact area. Then a little amount of load is applied while applying the voltage between 4a and 4b, and the current is supplied towire 3 from 4a and then to 4b to causes the Joule heat at the contact area between wire 3 and electrode 2. Thus, the tentative welding is carried out. After this, the conduction and heating is given unitl the solder of electrode 2 fuses well, and wire 3 is made to fall into the fused solder electrode 2 by its empty weight to carry out the main welding. In such way, the bonding is possible regardless of the thickness dispersion of the solder layer, thus enhancing the reliability. |
