| 摘要 |
PURPOSE:To adhere a heat spreader composed of two kinds of metal to a heat sink hard enough in a region except the operating region of a semiconductor chip, without causing strain near the operating region. CONSTITUTION:On electrode 8 near luminous part 10 of semiconductor chip 1, metal layer 12 is formed approximate three times as wide as luminous part 10. This layer, plated with silver, copper, etc., is large in thermal conductivity and hard to be alloyed with In solder. On the remaining part on electrode 8, gold layer 13 is selectively formed which is easy to be alloyed with In. Heat spreaders 12 and 13 are mounted on heat sink 14 and then fixed by solder 15 and, in consequence, the solder remains as soft metal In is since layer 12 is never alloyed, so that no strain will appear in the active region of the chip. As a result, layer 13 is alloyed with In and comes in hard contact with the heat sink.
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