| 摘要 |
PURPOSE:To obtain a holding plate which treats many chip components at a time by a method wherein, in a state that pins are pierced into through holes in a hard substrate formed together with a flat-board part having a plurality of through holes at an inner peripheral face of a frame part, a liquid elastic material is poured and hardened. CONSTITUTION:A hard substrate 11 composed of a metal material is formed together with a flat-board part 13 where a plurality of through holes 14 have been made nearly in the middle in a whole region inside a frame part 12. Inside faces of the frame part 12 are coated with an adhesive 24; this adhesive is dried naturally; after that, the hard substrate 11 is set and sandwiched between an upper die 25 and a lower die 26. During this process, at the upper metal mold 25 many pins 27 protrude downward in positions corresponding to the through holes 14 in the hard substrate 11, are pierced through the central part of the through holes and inserted into pin-receiving holes 28 in the lower metal mold 26. Then, a liquid elastic material 15 is poured into cavities constituted of the dies 25, 26 and the hard substrate 11. After that, the material is heated and hardened; after the material has been hardened, the metal molds are released; a holding plate is completed. |
