METHOD OF ATTACHING INTEGRATED CIRCUIT CHIP

摘要

PURPOSE: To obtain a method for fixing a direct bonding integrated circuit chip quickly to a circuit board or the like without modifying the substrate and without requiring any special chip holder by aligning an integrated circuit chip with the member of a set of stencil mask having a hole at same position using the set of stencil mask. CONSTITUTION: A transfer plate 27 for lifting an integrated circuit chip 31 is made from a stencil mask 13 having holes 15 at positions corresponding to solder bumps 17 on a substrate 11 to be fixed with the chip 31 having contacts 33 being connected with the solder bumps 17. The integrated circuit chip 31 is then arranged to deal with connection with the solder bumps 17 on the substrate 11. Subsequently, the integrated circuit chip 31 is lifted from the transfer plate 27 while keeping the arrangement. Finally, the contacts 33 of the chip 31 are brought into contact with the solder bumps 17 on the substrate 11 before being connected each other.