| 摘要 |
PURPOSE:To bake fine pattern on wafer, by converting point light source into circular light flux and radiating mask. CONSTITUTION:The spherical mirror 1 is cut with two planes so that the tangent of the center 8 of the band spherical mirror intersects with the axis 3 in 45 deg. and the light source is placed at the cross point 5 between the plane through the point 8 and the axis 3, then the main ray 9 bends at right angle at the mirror 2 and the circular image is caused on the curved plane 10. Taking the band mirror as R, circular arc image is formed on the plate having the slit S1 opening in circular shape by using the band spherical mirror R1 and the reflection mirror M1, and the shape on the mask MK is adjusted by adjusting S1. Further, two point image is caused on the screen VS with the light source and the mirror Ro via the reflection mirror M1-band spherical mirror R2-semi- transparent mirror M3. This is aligned. The light further reaches the MK plane via the reflection mirror M4-band spherical mirror R3-circular arc slit S2. Further, the image which passes through the equal magnification optical system, reflects on the mask and duplicates with MK, is observed. MK and the mask are embodied, the exposure stage is moved, and baking is made with the circular slit exposure. The adjustment of observation is made by interrupting the wave length of sensed light with filter. |
