X-ray analyzer for testing layered structures

摘要

X-ray fluorescence produced by a primary X-ray beam incident at a very flat angle (below 1 DEG ) onto the surface of a specimen contained in a vacuum chamber is used to analyze shallow layers and/or to determine depths of shallow surface layers, such as a very thin (typically between about 10A and 103A) silicon coating on Al or Cu layers which overlay a silicon substrate. Semiconductor profile determination may be another application of the invention.