| 摘要 |
<p>PURPOSE:To inspect the surface, by moving the semiconductor pellet arranged in a given distance toward X direction, and scanning the optical picture toward Y direction. CONSTITUTION:The pellet image 7 is fed toward X axis by the length p of the photo detection area of the element 11 of the detector 8, and output signal is obtained by making scanning from upper to lower toward Y direction at the position. Since judgement is made while shifting by p, required time can be reduced than conventional methods. The output signal of the detector 8 obtained in sychronizing with the clock pulse CP 13 is the waveform 12a due to the dicing groove. After the element of the detector scanned detects the most external circumference of the pellet, the amount of notch 14 for upper and lower side is judged by counting the number of CP reference determined with the size of pellet and the permissible amount of notch. Further, the pellet shift distance until the number of detection signal corresponding to the normal side is obtained or from the final normal signal to the final side judges the notch 15 at left and right side, and the size of the surface defect 17 is known by counting the continuous delete signal. Thus, physical appearence inspection can easily and quickly be made.</p> |
