| 摘要 |
PURPOSE:To enable a strip to be uniformly coated with soft solder without bending the strip by passing the strip through slits cut in both sides of a small-sized soft solder coating vessel on a soft solder-filled vessel and contacting the stip to molten soft solder circulating through the vessels. CONSTITUTION:The upper part of vessel 1 filled with molten soft solder 2 is provided with soft solder coating vessel 9 smaller than vessel 1 is in size while dipping the bottom of vessel 9 in solder 2. Solder 2 in vessel 1 is circulated from pipe 11 to the upper part of vessel 9 through pump 10. On the other hand, strip 4, esp. large-sized superconductive wire is passed through slits 8, 8 of vessel 9 from supply drum 3. During this time, it is contacted to soft solder flowing down from pipe 11 and coated with the solder. Strip 4 leaving vessel 9 is cooled with water, etc. sprayed from coller 6 and coiled round drum 7. |
