| 摘要 |
PURPOSE:To obtain a wafer whose top and reverse surface can be discriminated easily without adhesion work and with improvement of a degree of balance of installation. CONSTITUTION:Upper polishing tool 41 polishing the top surface side of wafer 3 uses a polishing tool of high work efficiency, and lower polishing tool 42 polishing the reverse surface side uses that of lower work efficiency than that of upper polishing tool 41. Between upper polishing tools 41 and lower one 42, carrier 7 with inserted wafer 3 is interposed, and upper and lower polishing tools 41 and 42, and wafer 3 are put into motion over a supply of an abrasive. Consequantly, a perfect mirror surface without distortion is formed on the top surface of wafer 3, and a surface with the marks of a pre-process or work distortion left is formed on the reverse surface side. |
