| 摘要 |
PURPOSE:To ensure the bevelling of a desired shape in a high reproducibility by forming the bevel part through contact between the pellet periphery part and the diamond grindstone after giving a fixed-speed turn to the semiconductor element obtained by adhering the semiconductor pellet to the substrate. CONSTITUTION:Semiconductor pellet 1 is soldered onto substrate 3 via solder 2, and substrate 3 is held by chuck 8 and 8' and via buffering substance 10. Then chuck 8 is pushed up to actuate spring 11, and at the same time pellet 1 is made to touch upper tool 9. Under these conditions, a fixed-speed turn is given to chuck 8 and 8'. After this, diamond grindstone 12 containing fixed surface 19 to touch pellet 1 is turned in the opposite direction to chuck 8 and 8' and pressed to the periphery part of pellet 1. Thus, bevel part 18 is formed. In this way, the uniform bevelling can be formed with a desired angle by selecting grindstone surface 19.
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