发明名称 THIN FILM THERMAL HEAD
摘要 <p>PURPOSE:To increase the life of a thin film thermal head with a simple structure by employing a TaC-Si material as a heating resistor, and specifying the composition ratio of its SiC. CONSTITUTION:A thermal head employs an alumina board 1 as an insulating board, and a glazed layer 2, a TaC-SiC heating resistor layer 3, an electrode layer 4, an oxidation preventive film and a wear resistant layer 5 are sequentially laminated and formed on the board 1. The composition ratio of the SiC to the TaC is set to 1-5W%. When the composition ratio of the sole TaC of the resistor and the SiC of the TaC becomes approx. 10W%, the ageing change of the resistance value becomes abrupt, but when the ratio of the SiC is 2-3W%, the ageing change is smooth. When the ratio is 1-5W%, it is sufficient. Thus, the life of the head can be increased.</p>
申请公布号 JPH0218901(A) 申请公布日期 1990.01.23
申请号 JP19880167689 申请日期 1988.07.07
申请人 JECO CO LTD 发明人 ITO EIJI;HATANO YUICHI
分类号 B41J2/335;H01C7/00 主分类号 B41J2/335
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