| 摘要 |
The invention provides a method of making a layered electrical device having interconnections (34), which may be microscopic in size, through an insulating layer (12a, 12b) between two conducting layers (10, 11). The insulating layer is double, comprising a first layer (12a) resistant to a first etching process but etchable by a second process, and a second layer (12b) etchable by the first process but resistant to the second. A mask (30) is provided to define the position of the required interconnection, and the second layer (12b) is etched by the first process. The first layer (12a) is then etched by the second process, the second layer (12b) acting as a hole-defining mask (32) during this step. Conducting material is then deposited on the insulating layers to form the second conducting layer (11) and the connection (34) through the hole.
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