发明名称 MANUFACTURE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To perform line junction efficiently, by making connection with element electrodes with ultrasonic waves and with leads by thermal pressing. CONSTITUTION:The cooling material 6 is closely mounted with the element mounting stand 4 on its surface, and it is hollow and has vent holes 6a' and 6a to prevent temperature rise of elements. The capillary 2 traverses with gold wire after ultrasonic welding of the gold wire 1 and moves to the upper direction of the lead ends. When the lead 5 is closely mounted on the upper surface of the heating material 7, no ultrasonic waves are required and connection can be made only with thermal pressing. With this method, the element performance can not be injured, no capillary choke is caused because of thermal pressing, and bonding can be made efficiently.
申请公布号 JPS54119876(A) 申请公布日期 1979.09.18
申请号 JP19780025963 申请日期 1978.03.09
申请人 TOKYO SHIBAURA ELECTRIC CO 发明人 INOUE KAZUO
分类号 H01L21/603;H01L21/60 主分类号 H01L21/603
代理机构 代理人
主权项
地址