| 发明名称 |
WERKWIJZE VOOR HET VERVAARDIGEN VAN EEN HALF- GELEIDERINRICHTING. |
| 摘要 |
A large-area semiconductor wafer with a backing member attached on one of its principal surfaces is divided into a plurality of small-area semiconductor pellets. A glass film is coated on the selected surface of each pellet and thereafter the pellets are detached from the backing member. |
| 申请公布号 |
NL161619(B) |
申请公布日期 |
1979.09.17 |
| 申请号 |
NL19730010947 |
申请日期 |
1973.08.08 |
| 申请人 |
HITACHI LIMITED, TOKIO. |
发明人 |
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| 分类号 |
H01L21/301;H01L21/00;H01L21/68;H01L23/29;H01L23/31;H01L29/00;(IPC1-7):01L21/78 |
主分类号 |
H01L21/301 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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