| 摘要 |
Equipment for bonding a semiconductor pellet to a semiconductor substrate, wherein the pellet is scrubbed onto a gold foil, previously formed on the substrate and heated by a first collet at a first station, so as to provisionally bond the pellet. The resultant substrate is subsequently moved to a second station, and the pellet is again scrubbed by the second collet, the pyramidal planes of which are brought into contact with the pellet and have a sharper inclination than the first collet, so as to bond the pellet with its fixed position corrected, whereby the bonding speed can be increased without lowering the positional precision of the bonding. |
