| 摘要 |
The metallised laminate is produced by treating a substrate with a release agent, depositing a layer of metal on the thus treated surface of the substrate, treating the top side of this conductive metal with improvement of its adhesive properties, bonding the conductive metal to a laminate, removing the substrate and thus obtaining the resulting metallised laminate. The metal layer has a thickness of 1 to 20 mu . When the metallised laminate is produced in this manner, it can be readily stripped off the material of the respective substrate. Such a laminate is used for example in printed circuit technology.
|
