| 摘要 |
PURPOSE:To simplify a breakaway after pressure collapse by providing a fine aperture for flowing air to a hard substrate surface when pressure-collapsing an abnormal projection produced on a semiconductor wafer surface in a process of crystal growth by pressing it down against the hard substrate surface. CONSTITUTION:Wafer 2 which has no abnormal projection on semiconductor- wafer mounting stage 1 is mounted with the projection up. By using driving mechanism 3, stage 1 is raised to push wafer 2 against hard substrate 4, made of sapphire or tungsten, arranged over state 1, thereby collapsing the abnormal projection by pressure. At this time, fine aperture 5 to be opened is provided to the surface of hard substrate 4 and after the pressure collapse, gas is supplied from the pressure feed mechanism connected to it, thereby making wafer 1 break away from hard substrate 4. As a result, trouble that substrate 4 and wafer do not break away keeping contact will not occur and the breakaway is simplified without damaging wafer 1.
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