| 摘要 |
PURPOSE:To permit the conductive coupling of metal and metal foil as well as the removal of resin layer by the procedure in which base metal and metal foil are temporarily jointed with a non-conductive resin layer, and then pressurized while applying supersonic vibration. CONSTITUTION:The metal foil 9a is laid over the base metal 10a through the non- conductive resin layer 9b, and then the chip 1 with the uneven pressure surface 1a is pushed against the metal foil 9a and applied a supersonic vibration from a vibrator. Thus, the resin layer 9b below the convexed portion is removed by the application of pressure and transverse vibration to the convexed portion, while the resin layer 9b removed from the adjacent convexed portion flows into the resin layer 9b below the concaved portion, whereby the copper foil 9a comes into contact directly with the base metal 10a in the convexed portion of the chip 1, assuring good conductive coupling with the aid of the heat of friction resulting from supersonic vibration. |
