发明名称 Printed circuit board assembly fixing terminals of components to board - drills holes through insulation sealed by conducting layer with smaller hole dia. than that of component leads
摘要 <p>The printed circuit board assembly system incorporates an improved method of fixing the terminal wires of the electronic components onto the board. The panel phenomena in the soldered section of the component wires is avoided. This method achieves more compact wiring and improves component density. The conducting area on the printed circuit board is not drilled. There are preset holes (4) which are formed by drilling through the insulating layer (12) so that one end of the holes concerned (14) will be sealed off by the conducting layer. The dia. of the hole is smaller than that of the component leads.</p>
申请公布号 FR2417236(A1) 申请公布日期 1979.09.07
申请号 FR19790003065 申请日期 1979.02.07
申请人 CHUO MEIBAN MFG CO LTD 发明人
分类号 H05K3/00;H05K3/30;H05K3/32;H05K3/34;H05K3/40;(IPC1-7):05K13/02;05K1/18 主分类号 H05K3/00
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