| 摘要 |
<p>PURPOSE:To save a costly bonding wire during a mounting operation of an IC element by a method wherein a sheet thickness in a semiconductor-element loading part of a tab is made half or lower a sheet thickness of a lead pin by using a photoetching method in order to make the sheet thickness in the IC element loading part of the tab thin. CONSTITUTION:A sheet thickness in a position where an IC element 3 has been loaded on a tab 2 is made half or less than half a sheet thickness of lead pins 1, 1. Accordingly, a height difference between the IC element 3 and the lead pins 1, 1 is made small by this amount; bonding wires 4, 4 can be connected in a nearly shortest distance without setting a surplus long loop. In addition, when a lead frame is formed, it is most desirable to form it by a photoetching method; thereby, it is possible to completely eliminate a bad effect of a processing strain.</p> |
