| 摘要 |
<p>PURPOSE:To remove surely and in a short while Au plating which is conducted on a component lead by immersing, first of all, the component lead which is plated with Au in an Sn dip vessel and performing the first preliminary soldering, thereby performing the second preliminary soldering after immersing it in an In-Sn dip vessel. CONSTITUTION:A component lead 10 which is treated by Au plating 2 is, first of all, immersed in an Sn dip vessel 3 and the first preliminary soldering is performed. Then, the second preliminary soldering is conducted after immersing the above lead in an In-Sn dip vessel 4. In this way, the preliminary soldering is performed by separating its treatment into two stages. On the occasion of the first preliminary soldering, Au plating on the component lead 10 is removed efficiently after being diffused in Sn and an In-Sn layer which has the same composition as that of a bump 16 is formed on the component lead 10 by the second preliminary soldering. The conditions in the case of component mounting are thus remarkably improved.</p> |
