| 摘要 |
PURPOSE:To improve the yield of bonding and the reliability of a product and reduce the cost of the product by causing a paste-form junction material to incorporate a spacer which has a grain size larger than components constituting the junction material. CONSTITUTION:A junction material is obtained by mixing silver paste 10 (the grain size of each constituent material is approximately 1mum) which is used generally and spacer 11 which consists of a conductive material having a grain size larger than paste 10, for example, silver, copper, etc., and this junction material is applied to substrate 12. In this case, applied layer 13 is made thicker than the grain size, for example, by approximately 10mum. Next, pellet 16 is vacuum-adsorbed by collet 15, etc., which has adsorption concave 14 consisting of a quadrangular pyramid concave in the lower face, and collet 15 is caused to descend onto applied layer 13 on substrate 12. Then, pellet 16 is pressed against applied layer 13, and simultaneously, pellet 16 is vibrated horizontally to be scraped to substrate 12, thereby fitting the pellet. As a result, a strong adhesion strength is obtained, and the yield of wire bonding can be improved.
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