Mechanism for chip-cutting and chip-ejection in the perforation of signatures

摘要

The invention contemplates mechanism for perforating signatures for ultimate use in glued binding of the signatures into a book. The perforating mechanism cuts chips in the course of continuous transport of the signatures, and the arrangement is such that the chips are transiently supported and transported out of the chip-cutting zone prior to forced ejection from the mechanism, thereby avoiding any fouling accumulation of retained chips at the cutting zone.