发明名称 |
Assembly system for microcomponent devices such as semiconductor devices |
摘要 |
An assembly system for assembling microcomponents of semi-conductor or other electronic devices includes on a unitary machine frame the tooling for precision excising tape mounted microcomponents, precision forming their electrical leads, placement of the components in correct registration with conductors on a pre-positioned substrate, and bonding the formed leads to the conductors.
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申请公布号 |
US4166562(A) |
申请公布日期 |
1979.09.04 |
申请号 |
US19770829837 |
申请日期 |
1977.09.01 |
申请人 |
JADE CORP THE |
发明人 |
BROWN, DONALD B;KEIZER, ALAN S |
分类号 |
H01L21/00;H01L21/60;H01L21/603;H05K13/04;(IPC1-7):H01L21/98 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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