| 摘要 |
<p>PURPOSE:To simplify the breakaway of an element with the contact strength between the element and a thin plate weakened by sticking a semiconductor wafer with notch lines among many formed semiconductor elements to a flexible thin plate and by turning this thin plate supported on a support stand in a curved shape by a fixed angle. CONSTITUTION:Semiconductor wafer 1 with several semiconductor elements 2 formed is provided with notch lines 4 and 5 and then stuck to flexible thin plate 3. Next, this thin plate 3 is held on spherical support stand 9 provided with ring- shaped concave grooves 10 at adequate positions and shifted fixed angle by fixed angle to cause wafer 1 to generate bending force, so that wafer 1 will be divided at notch lines 4 and 5. Next, thin plate 3 is pushed against the spherical surface of support stand 9 and fixed to concave grooves 10 by using wedges 11. In this way the contact strength of each element 2 to thin plate 3 is weakened and each element 2 is broken away by collet 12. Consequently, the automatic mounting of each element is simplified.</p> |
