| 摘要 |
PURPOSE:To avoid the damage in ribbon, by shifting the base ribbon with step in the condition that the space between the die bonding lower surface of the base ribbon and the bonding heater is apart by a given distance. CONSTITUTION:After bonding the semiconductor element 4 on the die bonding part 6 of the base ribbon 1 with solder 3, by lifting up the ribbon 1, the bottom of the die bond 6 is taken the height so that the convex 18 of the heater block 15 can easily be exceeded. After this, when shifting is made, the base ribbon is not in contact with the heater block after die bond and lead bonding, and the damage of ribbon and wire cut off are not caused. |
