An arrangement for the connection and enclosure of at least one semiconductor member

摘要

An arrangement for the connection and enclosure of at least one semiconductor member 1 having a plurality of electrical terminal contacts 2 on one outer surface comprises a non-conductive substrate 5 bearing a corresponding number of conductor strips 6 which are electrically connected to the contact terminals of the semiconductor member. The semiconductor member is fixed to a metal mounting part 4 which serves as a heat sink and to which substrate 5 is also stuck. Sealing is effected by a plastics filing within former 7. Member 1 may alternatively be mounted beyond the end of substrate 5 on a cranked part of part 4.