Tape-mounted electronic component package

摘要

A package for storing and feeding electronic components having parallel leads mounted equidistantly by the leads on tape is provided. The tape is wound in a spiral and packaged in the box prepared from a box blank. The box has a removable side face which is removed from the box for forming an opening through which the tape and the electronic components mounted thereon can be fed either manually or automatically without opening the package itself. The removable side face has an elongated retainer flap for serving to hold the tape and the electronic components mounted thereon firmly in position within the box.