发明名称 THERMAL HEAD UNIT
摘要 PURPOSE:To reduce the space for handling of lead wires thereby to reduce the size of the body of an apparatus by attaching a head drive circuit and a thermal head to a head holder. CONSTITUTION:A number of common lead wires K, L, M and N and an image signal lead wire Z are arranged between a head drive circuit 4 and a thermal head 2. Since the head drive circuit 4 and the thermal head 2 are attached to a head holder 3, they can be easily hendled with the use of a thermal head unit 1. As a result, the lead wires arranged through the body of an apparatus can be composed only of the drive lead wires i of the head drive circuit 4 and the lead wires j for transmitting image signals from a control circuit 18 to the head drive circuit 4. Thus, it becomes unnecessary to elaborately arrange the numerous lead wires so that the size of the apparatus body can be reduced.
申请公布号 JPS54109455(A) 申请公布日期 1979.08.28
申请号 JP19780017289 申请日期 1978.02.15
申请人 NIPPON TELEGRAPH & TELEPHONE;MATSUSHITA GRAPHIC COMMUNIC 发明人 SHIMIZU HARUMITSU;FUDANOTSUJI TAKUO;MATSUMOTO TETSUO;NAGAHIRO MICHINORI
分类号 B41J2/335;B41J2/345 主分类号 B41J2/335
代理机构 代理人
主权项
地址