Pretreatment of light metals prior to soldering - consists of applying layer of palladium-nickel alloy after cleaning surface

摘要

The pretreatment consists of applying a layer(a) of a Pd-Ni the alloy to the surface of the light metal to be bonded. The alloy pref. contains 20-70% Ni, and may also contain 3-20% of Cr and/or Mn and/or Ti. The layer is pref. applied by vapour deposition in vacuo, or by sputtering; and the joint surfaces may first be cleaned by ion bombardment, i.e. sputter etching. When the layer is applied by sputtering, an underlayer of Cr, Ti, Mg or Al, providing adhesion for this layer, may be deposited by sputtering. The light metals can be soldered with normal soft solders using conventional fluxes, to obtain adherent, defect-free joints.