| 摘要 |
PURPOSE:To simplify the manufacture, by mounting directly IC chip on the concave placed on the insulation substrate, reducing the cost for manufacture and usage, and entirely unnecessary the line bonding. CONSTITUTION:The IC chips 14A and 14B are placed in the concave 12A and B on the insulation substrate 10, and the major plane at the electrode side constitutes common plane with the substrate surface. It is covered with SiO2 20 and the wiring layers 22, 24, 26 of Al are formed. The lines 30 and 32 cross with the wiring 24 via the second insulation layer 28. Although the lines 30 and 32 mutually cross at several parts, isolation is made by providing the third insulation layer 34 on the layer 28, and resistor 36 is connected by leading it on the layer 34. With this constitution, the package and IC socket are unnecessary, line bonding is not required, and simultaneous formation is possible, enabling to simplify the manufacture. |
