发明名称 HIGH DENSITY SEMICONDUCTOR CHIP ORGANIZATION
摘要 <p>HIGH DENSITY ARCHITECTURE FOR A SEMICONDUCTOR CHIP A semiconductor chip layout including a plurality of logic cells arranged in columns. A cell may encompass one of two different magnitudes of area in the chip; and each column contains only cells having the same area. The layout is particularly appropriate for level sensitive logic systems which utilize both combinatorial as well as sequential networks. The combinatorial (combinational) networks are less orderly and require a greater number of selectable input connections, hence more area, than the sequential circuits. The wide and narrow columnar architecture allows a much greater circuit packing density on a chip, resulting in a substantial increase in the number of circuits for a given chip area. Performance is also increased because of the reduced area required by the sequential circuits.</p>
申请公布号 CA1061009(A) 申请公布日期 1979.08.21
申请号 CA19760255043 申请日期 1976.06.16
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 EICHELBERGER, EDWARD B.;ROBBINS, GORDON J.
分类号 H01L21/822;H01L21/331;H01L21/82;H01L27/04;H01L27/118;H01L29/73;H03K19/173;(IPC1-7):01L27/10;01L29/06;01L23/48 主分类号 H01L21/822
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