| 摘要 |
PURPOSE:To forcibly make smooth the surface of solder and to enable to supply a fixed quantity of the solder, by providing levelling block on rotating solder receiver at supplying apparatus of soft solder mounting semiconductive chips etc. on the stem etc. CONSTITUTION:The solder S, such as silver paste etc., is filled in the receiver 1 and the supporting shaft 7 is dropped down by the operation of the regulating screw 6 and lower tip end of the levelling block 8 is situated at a fixed height from the inner bottom part of the receiver 1 by dipping the above tip end in the solder S. Next, the surface of the solder S is pushed on the tip end of the block 8 and is controlled smooth when the receiver 1 is rotated driving the motor 4. Then, the solder take-out jig 9 is dropped down and the receiver 1 is taken out contacting a part of the solder S and then, is supplied to stem, lead frame etc.
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