| 摘要 |
PURPOSE:To enable to use crystal excellent in thermal expansion coefficient as transparent package material, by assuring the air-tightness of transparent package, when the transparent package material is taken single crystal material such as crystal. CONSTITUTION:The metal oxide 16 such as transparent SiO2 is coated on the surface of the transparent package 1 as thin film, to choke the through-hole 15 injuring the air-tightness of the needle part caused by half etching for the concave 14. As the processing, organic compound is dissolved in alcohol solvent and mixture added with acid is taken as processing solution. The crystal oscillator package 1 fored by etching the wafer of single crystal is immersed in it, the processing solution is uniformly coated with equal speed lifting, and alcohol and acid are removed with heating. Further, sintering is made at about 500 to 700 deg.C, and metal oxide 16 is formed. Thus, the air-tightness of the transparent package 1 can sufficiently be assured. |
