Cooling device for semiconductor chip with hole - uses chip which is pressed to case wall which forms one supply electrode and has other electrode in form of pin and plate

摘要

The chip has anode and cathode electrodes making pressure contacts with supply electrodes. The chip is mounted in a liquid-tight metal case (5, 6) under cooling medium pressure, with at least one front wall (23) to which the semiconductor chip (1) is pressed. The front wall forms one of the supply electrodes, while the other supply electrode is connected through a metal plate with a connecting pin (9) passing through the hole (4) in the chip (1) and a hole (20) in the case (5, 6) front wall. The connecting pin (9) is coaxial with a similar pin (13) in the opposite wall.