发明名称 SPUTTERING APPARATUS
摘要 PURPOSE:A sputtering apparatus is constructed so that high frequency is applied to a sputter source consisting of coil to sputter it, and the sputtered material covers an opposingly disposed object, forming uniform, well-adhered, high quality coating layer. CONSTITUTION:A sputter source consists of a plural turn coil in which cooling water flows. A object 2 to be coated is placed inside the coil 7. High frequency 6, high voltage is applied across the object 2 and the negative coil 7 to cause cathode glow near the negative coil 7. Excited gas particles are ionized, and the ionized particles collide with the coil 7 surface to sputter the coil material, splashing them to coat onto the object surface 2. The process is particularly useful for coating elongated object.
申请公布号 JPS54103789(A) 申请公布日期 1979.08.15
申请号 JP19780010486 申请日期 1978.02.03
申请人 HITACHI LTD 发明人 KOJIMA YOSHIYUKI;ASAHI NAOTATSU
分类号 C23C14/40;C23C14/34;H01J37/34 主分类号 C23C14/40
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