| 摘要 |
A method and apparatus for loading solder preforms on to the pins of a multiple pin connector. A positioning plate has open sockets in the pattern of the pins of the connector to be loaded, the sockets being sized to receive a single solder preform in each one. A slidable retainer fits into a channel below the positioning plate to partially close the sockets and retain preforms therein. Loose preforms are contained in a dam attached to the top of the positioning plate and are shaken into the sockets on a vibrator table. The dam and excess preforms are removed and the positioning plate is covered by a cover plate to hold the preforms in place. The connector pins are then inserted through slots in the retainer, through the preforms and through holes in the cover plate. The retainer is removed, allowing the preforms to drop on the pins and the loaded connector is removed from the apparatus.
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