首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
DEVICE FOR ORNAMENTATION UNDER WALL
摘要
申请公布号
JPS54103207(A)
申请公布日期
1979.08.14
申请号
JP19780009615
申请日期
1978.01.30
申请人
NAT JUTAKU KENZAI
发明人
KUBOTA HIROMICHI
分类号
E04F19/02;E02D27/00;E02D27/01
主分类号
E04F19/02
代理机构
代理人
主权项
地址
您可能感兴趣的专利
HIGH-K DIELECTRICS WITH A LOW-K INTERFACE FOR SOLUTION PROCESSED DEVICES
NON-VOLATILE MEMORY DEVICE AND MANUFACTURING METHOD THEREOF
SPLIT POLY CONNECTION VIA THROUGH-POLY-CONTACT (TPC) IN SPLIT-GATE BASED POWER MOSFETS
Tailoring the Optical Gap and Absorption Strength of Silicon Quantum Dots by Surface Modification with Conjugated Organic Moieties
LANDSIDE EMBEDDED INDUCTOR FOR FANOUT PACKAGING
DISPLAY DEVICE, METHOD FOR DRIVING THE SAME, AND ELECTRONIC APPARATUS
PIXEL STRUCTURE AND ELECTROLUMINESCENT DISPLAY HAVING THE SAME
ORGANIC LIGHT-EMITTING DIODE DISPLAY PANEL
BACK SIDE ILLUMINATED IMAGE SENSOR WITH DEEP TRENCH ISOLATION STRUCTURES AND SELF-ALIGNED COLOR FILTERS
MICROBOLOMETER CONTACT SYSTEMS AND METHODS
REWORK METHOD OF ARRAY SUBSTRATE FOR DISPLAY DEVICE AND ARRAY SUBSTRATE FORMED BY THE METHOD
METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE
3-D NON-VOLATILE MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
Structure and Method for FinFET Device
SEMICONDUCTOR DEVICE
LIGHT EMITTING DIODE PACKAGE STRUCTURE
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
Carrier Tape for Tab-Package and Manufacturing Method Thereof
STRUCTURES AND METHODS FOR REDUCING CORROSION IN WIRE BONDS
Profile of Through Via Protrusion in 3DIC Interconnect