| 摘要 |
<p>PURPOSE:To improve an overcurrent protective function by a method wherein a mechanical switch composed of a material which is resistant to an overcurrent as compared with a semiconductor, such as a bimetal, an electromagnet or the like, is installed inside a package in order to bypass the overcurrent. CONSTITUTION:A semiconductor chip 3 to which bonding wires 2-1, 2-2 have been connected is fixed onto an island 4b. The semiconductor chip 3 is insulated, by using an insulating bonding layer 6, from a conductor 5a installed on the bottom of a cavity in a ceramic container 1b. A bimetal segment 7 and a bonding pad of the semiconductor chip 3 are connected by using the bonding wire 2-2; when an overcurrent flows to the bonding wire 2-2, heat is generated; a temperature of the bimetal segment 7 is raised; the segment is curved downward and comes into contact with a contact segment 5b. In this state, the overcurrent is bypassed through the bimetal segment 7, the contact segment 5b and the conductor 5a and flows to an external lead 4a1; the semiconductor chip 3 is protected from the overcurrent. Thereby, an overcurrent protective function can be improved.</p> |
