| 摘要 |
PURPOSE:To supply a wire correctly by giving vibration to a wedge when the wire is supplied through a wire supply hole in the wire bonding method where the electrode of a semiconductor device is assembled by ultrasonic bonding with the wire. CONSTITUTION:When clamper 6 is closed to supply wire 3 between heel 5 of wedge 4 and electrode 2 of chip 1, ultrasonic vibration is given to wedge 4. After that, the wire is pressed by heel 5, and ultrasonic vibration is given, thereby bonding. |
