| 摘要 |
PURPOSE:To make always an optimum bonding load by controlling the bonding load according to a bonding state by a program in the wire bonding unit used for production of a semiconductor device, etc. CONSTITUTION:This unit consists of slim bonding arm 1 which is made slidable by support axis 2 and has cylindrical capillary 3, cam 4 which is rotated by servo-motor 15, lever 5 which is equipped with cam follower 7 and roller 8 which are fitted to support axis 9 slidably, wire 10 where the tip wound around the rotation axis of servo-motor 15 is fitted to arm 1, and driving means 23 of servo-motor 15 which consists of timing signal setting circuit 11, program circuit 12, electromagnetic relay RY1-3, operational amplifier 13 and current amplifier 14. |
