发明名称 |
MANUFACTURE FOR SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE:To avoid the side etching caused to the metal wiring crossing with the step, in the manufacture of semiconductor device. CONSTITUTION:The occurrence of side etching at the step part can be avoided by providing the dummy pattern 6a in which the width of the photo resist 6 in the step parts A and B is greater than that of the photo resist at other flat parts. |
申请公布号 |
JPS54101274(A) |
申请公布日期 |
1979.08.09 |
申请号 |
JP19780007208 |
申请日期 |
1978.01.27 |
申请人 |
HITACHI LTD |
发明人 |
TAKAHASHI SHIGERU;TSUKUDA KIYOSHI |
分类号 |
H01L21/30;G03F1/00;G03F1/68;G03F1/70;H01L21/027;H01L21/302 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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