| 摘要 |
A metallic decoration pattern is applied by electrodeposition on metallic surfaces delimited by a masking ink eg deposited by silk- screen printing or a pad having a resiliently deformable surface. After electrodeposition eg of copper on a stainless steel surface the ink is removed with a solvent. Alternatively the ink pattern can delimit areas of electrodeposited metal; first to enable unmasked areas of electrodeposited copper to be removed with a solvent, then masking of electrodeposited silver, respectively using positive and negative silk- screens, prior to final deposition of silver-gold alloy. |
