| 摘要 |
PURPOSE:To shorten the time during which the pellet temperature reaches the necessary level and thus to increase the bonding efficiency by heating up previously the pellet used for bonding. CONSTITUTION:Pellet storage tool 2 to store semiconductor pellet 1 is heated up previously at the botton via heater 3. And pellet 1 is bonded to the tub part of lead frame 6 on heat block 5 while being adsorbed by collet 4. Thus, the time during which pellet 3 temperature reaches the eutectec point via collet 4 which is cooled down by the air passing through vacuum suction hole 9 can be shortened by the fact that pellet 1 has been heated up previously. Here, figure 7 and 8 indicate the bonding arm and the built-in heater respectively. As a result, the pellet bonding time can be reduced with good fusing state of the eutectic alloy secured, reducing the deterioration of the characteristics. |
