| 摘要 |
<p>PURPOSE:To measure the reduced amount without removing the grindstone and maintain excellent grinding at all times by allowing the grindstone and grinding table to touch each other before and after dicing and electrically detecting the positional difference of grinding table detected before and after dicing. CONSTITUTION:Grindstone 5 is mounted on the end of the freely revolving spindle 4 which is protruding from spindle head 3 which can be freely adjusted in the direction 2 in which main unit 1 of this system moves back and forth, wafer 10 is fixed on grinding table 6 which moves back and forth in relation to grindstone 5 and divided grooves 10a and 10b are formed by in-feeding wafer 10 by relatively moving it back and forth. Before and after forming these divided grooves 10a and 10b, dial gauge 11 touches table 6 and grindstone 5 for electrically detecting the standard position of table 6 by means of gauge 14 of zero electric potential setting system 12, thus measuring the reduced amount without removing grindstone 5.</p> |
