发明名称 AMORPHOUS METAL LAYER
摘要 <p>These amorphous metal-alloy films include nitrogen, greater than about one atomic percent at least one transition metal selected from Cr, Fe, Co and Ni with at least one element forming an amorphous alloy therewith, selected from the "glass forming" elements, i.e., B, Si, Al, C and P. The alloys can be formed by deposition in a vacuum chamber. When films are sputtered, the target is composed of the above alloy elements with at least one element selected from each of the transition metal and glass forming element groups. Sputtering occurs in an atmosphere above about 2% vol. N2 gas mixed with an inert gas, e.g., Ar. Alloys produced include N, i.e., (Co-Fe-B)N and (Fe-B)N. Above about 2 atomic % N in the film, films have lower values of saturation magnetization 4 pi Ms. Above a 2% vol. N2 gas in the plasma, electrical resistivity increases. Over 0.5% vol. N2 gas in the plasma, the film's effective perpendicular anisotropy field Hk* increases. For (Co-Fe-B)N, the anisotropy direction moves from in plane to perpendicular above 2% vol. N2 plasmas. For (Fe-B)N, Hk* increases with N2 up to 10% vol. N2 plasma. The N% in a film varies linearly with the log of N2% vol. Films show markedly improved adhesion, corrosion resistance and hardness. Magnetic thermal stability increases with N2 above about 5% vol. N2 in a plasma. Structural and magnetic properties are stable for annealing up to 400 DEG C.</p>
申请公布号 JPS5494428(A) 申请公布日期 1979.07.26
申请号 JP19780134636 申请日期 1978.11.02
申请人 IBM 发明人 JIEROOMU JIYON KUOMO;AMITABA GIYANGURII;ROBAATO JIYON KOBURISUKA
分类号 C22C1/00;C22C45/04;C23C14/00;C23C14/14;C23C30/00;H01C7/00;H01F10/12;H01F10/13;H01F10/14;H01F41/18 主分类号 C22C1/00
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