| 摘要 |
<p>The method of applying a metallic contact strip to a semiconductor and the strip per se. The contact strip consists of three sequential layers of different metals stacked upon each other. The lowest layer, i.e., that adjacent the semiconductor, possesses a high affinity toward oxygen and is preferably selected from molybdenum, tungsten, vanadium and chromium. The middle layer is selected from iron, cobalt, nickel, manganese and chromium. The outer layer is a noble metal.</p> |
